On November 18, 2025, Emdoor Information attended the Intel Technology Innovation and Industry Ecosystem Conference 2025 held at Chongqing Yuelai International Conference Center. The event featured Emdoor’s comprehensive AI computing products across mobile office, creative work, enterprise, and interactive scenarios, highlighting on-device AI advancements powered by the latest Intel platforms.
High-Performance AI PCs and Mini Hosts for Diverse Scenarios
Emdoor Digital emphasized innovations in AI PCs and mini hosts, positioning them as versatile productivity engines with ultra-light designs.
The 839 series notebooks, equipped with Intel Core mobile processors (Arrow Lake), support up to 80W performance release for smooth multitasking and demanding applications. Paired with an 80Wh battery, they excel in mobile office and content creation. Complementing these, the 26 series Mini PCs deliver 65W output in a compact 0.6L form factor with quad-screen support—perfect for space-constrained enterprise setups.
Additional offerings include the 07 series OPS modules, IAW19-H810 motherboards, and CM670 NAS solutions, forming a robust ecosystem from embedded computing to storage.
For portability, Emdoor’s ultra-light AI PC lineup shines: the 326-LD series weighs under 999g with 45W performance (Lunar Lake-based), while the 326-DY achieves 15-hour battery life at 990g—balancing power and mobility.
Rugged AI PCs: Reliable Intelligence for Harsh Environments
Emdoor Information spotlighted industrial-grade rugged AI PCs, including the EM-X14M and EM-X15M notebooks plus EM-I14M tablet. These devices target manufacturing, automotive, surveying, and public safety.
Powered by Intel® Core™ Ultra processors with dedicated NPU (up to 32 TOPS), they support broad AI model compatibility for local deployment—ensuring fast, secure on-device experiences. Integrated Intel Arc™ graphics (Xe LPG architecture, up to 8 Xe cores) handle advanced tasks like ray tracing and AV1 encoding, rivaling discrete GPUs.
Built for extremes, these rugged AI PCs meet IP65 and MIL-STD-810H standards, resisting dust, water, drops, and temperature swings. Features include dual memory/storage slots, high-brightness screens, Thunderbolt 4, Wi-Fi 6, 5G, and hot-swappable dual batteries—driving efficiency in challenging field operations.
Emdoor Information spotlighted industrial-grade rugged AI PCs, including the EM-X14M and EM-X15M notebooks plus EM-I14M tablet.
AI Glasses + AI PC Collaboration: Redefining Interaction
EmdoorVR partnered with Emdoor Digital to demonstrate an integrated AI glasses and AI PC solution, powered by multimodal models for distributed computing.
The setup pairs next-gen AI glasses (with 12MP ultra-wide camera) and an AI PC featuring Intel® Core™ Ultra 200V (up to 120 TOPS total AI compute). This creates a “perception-compute-generation” loop: glasses capture and preprocess scenes in real-time, while the PC handles intensive tasks like HD rendering and 3D modeling—minimizing latency.
Applications span industrial inspections (instant fault analysis) and education (rapid 3D visualizations), evolving glasses from sensors to intelligent endpoints and advancing immersive workflows.
Long-Term Partnership Driving AI Accessibility
As a key Intel ecosystem partner, Emdoor integrates cutting-edge technologies with industry needs. The showcased portfolio—from lightweight AI PCs and Mini PCs to glasses collaborations and rugged series—demonstrates unified strength in making AI practical, from consumer to industrial edges.
This presence at the Chongqing conference underscores Emdoor’s commitment to evolving AI from emerging tech to everyday productivity enhancer.
